Package on package devices and methods of packaging semiconductor dies
US8981559B2 · kind B2 · utility
50Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2012 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Jun 25, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3651
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. In one embodiment, a PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal pillars are coupled to the first packaged die. The metal pillars have a first portion proximate the first packaged die and a second portion disposed over the first portion. Each of the metal pillars is coupled to a solder joint proximate the second packaged die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.