Versatile communication system and method of implementation using heterogeneous integration
US8983414B2 · kind B2 · utility
1Cited by
3References
44Claims
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Key dates
| Filing date | Jun 10, 2013 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Aug 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/70
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A communication system front-end architecture and a method of fabricating same are disclosed in which a diverse set of semiconductor technologies and device types (including CMOS, SiGe CMOS, InP HBTs (heterojunction bipolar transistors), InP HEMTs (high electron mobility transistors), GaN HEMTs, SiC devices, any number from a diverse set of MEMS sensors and actuators, and potentially photonics) is merged onto a single silicon, or other material substrate to thereby enable the development of smaller, lighter, and higher performance systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.