Patent · US Active

Method and apparatus to configure thermal design power in a microprocessor

US8984305B2 · kind B2 · utility

2Cited by

6References

21Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Eric Distefano · Livermore, US
Guy M. Therien · Beaverton, US
Vasudevan Srinivasan · Hillsboro, US
Tawfik M. Rahal-Arabi · Tigard, US
Venkatesh Ramani · Milpitas, US
Ryan D. Wells · Folsom, US
Steven H. Gunther · Beaverton, US
Jeremy J. Shrall · Portland, US
James G. Hermerding, II · Vancouver, US

Key dates

Filing date	May 27, 2011
Grant date	Mar 17, 2015
Priority date	—
Expiry date	Nov 30, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02D10/00
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.