Low-temperature curable conductive paste for plating and electric wiring using the same
US8986575B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 22, 2009 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Nov 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0347
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive paste containing a conductive powder (A), a vinyl chloride-vinyl acetate resin (B), a polyester resin and/or polyurethane resin (C), a blocked isocyanate (D) blocked with an active methylene compound, and an organic solvent (E), wherein the resin (C) has a glass transition temperature of −50° C. to 20° C., a sum of amounts of the resin (C) is 50 to 400 parts by weight relative to 100 parts by weight of the resin (B), and a sum of amounts of the resin (B), the resin (C) component, and the blocked isocyanate (D) is 10 to 60 parts by weight relative to 100 parts by weight of the conductive powder (A). An electric wiring in which this conductive paste is formed on an insulating substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.