Light-emitting device package and method of manufacturing the same
US8987022B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2012 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Mar 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.