Segmented guard ring structures with electrically insulated gap structures and design structures thereof
US8987067B2 · kind B2 · utility
2Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2013 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Mar 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are guard ring structures with an electrically insulated gap in a substrate to reduce or eliminate device coupling of integrated circuit chips, methods of manufacture and design structures. The method includes forming a guard ring structure comprising a plurality of metal layers within dielectric layers. The method further includes forming diffusion regions to electrically insulate a gap in a substrate formed by segmented portions of the guard ring structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.