Inventor · Shelburne, VT, US

Mark D. Jaffe

157Patents
16h-index
95Co-inventors
89Inventor score

Filing activity: Dec 22, 1995 → Apr 11, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US7193423B1 Wafer-to-wafer alignments Electricity 204 Expired
US6870225B2 Transistor structure with thick recessed source/drain structures and fabrication process of same Electricity 101 Expired
US7781781B2 CMOS imager array with recessed dielectric Electricity 50 Active
US7193289B2 Damascene copper wiring image sensor Electricity 41 Expired
US7622364B2 Bond pad for wafer and package for CMOS imager Electricity 38 Active
US9054671B2 Tunable filter structures and design structures Emerging Cross-Sectional Technologies 37 Active
US9349793B2 Semiconductor structure with airgap Electricity 32 Active
US7772028B2 CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom Electricity 25 Active
US9455187B1 Backside device contact Electricity 25 Active
US7205627B2 Image sensor cells Electricity 24 Expired
US7285477B1 Dual wired integrated circuit chips Electricity 24 Expired
US6943405B2 Integrated circuit having pairs of parallel complementary FinFETs Emerging Cross-Sectional Technologies 22 Expired
US7675097B2 Silicide strapping in imager transfer gate device Electricity 18 Active
US7821553B2 Pixel array, imaging sensor including the pixel array and digital camera including the imaging sensor Electricity 17 Active
US5734192A Trench isolation for active areas and first level conductors Electricity 17 Expired
US7517806B2 Integrated circuit having pairs of parallel complementary FinFETs Emerging Cross-Sectional Technologies 16 Expired
US8013342B2 Double-sided integrated circuit chips Electricity 16 Active
US10211146B2 Air gap over transistor gate and related method Electricity 15 Active
US7361989B1 Stacked imager package Electricity 14 Active
US8232190B2 Three dimensional vertical E-fuse structures and methods of manufacturing the same Electricity 13 Active
US7194706B2 Designing scan chains with specific parameter sensitivities to identify process defects Electricity 13 Expired
US7655495B2 Damascene copper wiring optical image sensor Electricity 13 Active
US7342268B2 CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom Electricity 13 Expired
US9514987B1 Backside contact to final substrate Electricity 13 Active
US7670927B2 Double-sided integrated circuit chips Electricity 12 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.