Reactive bonding of a flip chip package
US8987130B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2012 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Nov 24, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20641
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An array of bonding pads including a set of reactive materials is provided on a first substrate. The set of reactive materials is selected to be capable of ignition by magnetic heating induced by time-dependent magnetic field. The magnetic heating can be eddy current heating, hysteresis heating, and/or heating by magnetic relaxation processes. An array of solder balls on a second substrate is brought to contact with the array of bonding pads. A reaction is initiated in the set of magnetic materials by an applied magnetic field. Rapid release of heat during a resulting reaction of the set of reactive materials to form a reacted material melts the solder balls and provides boding between the first substrate and the second substrate. Since the magnetic heating can be localized, the heating and warpage of the substrate can be minimized during the bonding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.