Method for electrical connection between elements of a three-dimensional integrated structure and corresponding device
US8988893B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2012 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Jan 18, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A link device for three-dimensional integrated structure may include a module having a first end face designed to be in front of a first element of the structure, and a second end face designed to be placed in front of a second element of the structure. The two end faces may be substantially parallel, and the module including a substrate having a face substantially perpendicular to the two end faces and carrying an electrically conducting pattern formed in a metallization level on top of the face and enclosed in an insulating region. The electrically conducting pattern may include a first end part emerging onto the first end face and a second end part emerging onto the second end face and connected to the first end part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.