Patent · US Active

Method for manufacturing electronic devices and electronic devices thereof

US8992712B2 · kind B2 · utility

12Cited by

48References

20Claims

0Family size

Assignee

ARIZONA BOARD OF REGENTS, A BODY CORPORATE OF THE STATE OF ARIZONA ACTING FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY · US

Inventors

Douglas E. Loy · Chandler, US
Emmett Howard · Mesa, US
Jesmin Haq · Milpitas, US
Nicholas Munizza · Gilbert, US

Key dates

Filing date	Nov 21, 2012
Grant date	Mar 31, 2015
Priority date	—
Expiry date	Jan 25, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24975
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.