Passive position compensation of a spindle, stage, or component exposed to a heat load
US8995066B2 · kind B2 · utility
1Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2011 |
| Grant date | Mar 31, 2015 |
| Priority date | — |
| Expiry date | Jan 29, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/21
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed herein is an apparatus for providing passive correction for thermal effects on a mounted mechanical component. Further disclosed is a wafer inspection system employing the passive thermal effect correction apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.