Methods and systems for releasably attaching support members to microfeature workpieces
US8999498B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2013 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Jan 28, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.