Method for manufacturing a semiconductor component that includes a common mode choke and structure
US8999807B2 · kind B2 · utility
3Cited by
9References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2010 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Jan 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor component and methods for manufacturing the semiconductor component that includes a monolithically integrated common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.