Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
US9000071B2 · kind B2 · utility
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1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2013 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Apr 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/05
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.