Phosphazene compound having vinyl group, resin composition containing the same, and circuit board manufactured from the same
US9000077B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jun 19, 2013 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Jun 19, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A phosphazene compound having a vinyl group is manufactured by a reaction between a vinyl compound and a phosphazene compound having a hydroxyl group and added to a resin composition for manufacturing a prepreg or a resin film so as to be applicable to copper-clad laminates and printed circuit boards to thereby achieve satisfactory circuit laminate properties, namely low coefficient of thermal expansion, low dielectric properties, heat resistant, fire resistant, and halogen-free.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.