Patent · US Active

Semiconductor package having IC dice and voltage tuners

US9000490B2 · kind B2 · utility

6Cited by

74References

14Claims

0Family size

Assignee

XILINX, INC. · US

Inventors

Thao H. T. Vo · San Jose, US
Andy H. Gan · San Jose, US
Xiao-Yu Li · Palo Alto, US
Matthew H. Klein · Redwood City, US

Key dates

Filing date	Apr 19, 2013
Grant date	Apr 7, 2015
Priority date	—
Expiry date	Jun 29, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02D10/00
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes an interposer and a plurality of integrated circuit (IC) dice disposed on and intercoupled via the interposer. A first IC die has a clock speed rating that is greater than a clock speed rating of another of the IC dice. A plurality of programmable voltage tuners are coupled to the plurality of IC dice, respectively. A first voltage tuner is coupled to the first IC die, and the first voltage tuner is programmed to reduce a voltage level of voltage input to the first voltage tuner and output the reduced voltage to the first IC die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.