Semiconductor device, method of cutting electrical fuse, and method of determining electrical fuse state
US9000559B2 · kind B2 · utility
3Cited by
3References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 23, 2007 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Nov 1, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor substrate and an electrical fuse formed on the semiconductor substrate, and including a first conductor and a second conductor electrically separated from the first conductor. In a state of the electrical fuse after a cutting processing, the first conductor is cut and separated into a first part electrically separated from the second conductor and a second part including a flowing region from which a material constituting the first conductor flows outward and which is electrically connected to the second conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.