Packaged semiconductor device with a molding compound and a method of forming the same
US9000584B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2011 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Jun 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The mechanisms of forming a molding compound on a semiconductor device substrate to enable fan-out structures in wafer-level packaging (WLP) are provided. The mechanisms involve covering portions of surfaces of an insulating layer surrounding a contact pad. The mechanisms improve reliability of the package and process control of the packaging process. The mechanisms also reduce the risk of interfacial delamination, and excessive outgassing of the insulating layer during subsequent processing. The mechanisms further improve planarization end-point. By utilizing a protective layer between the contact pad and the insulating layer, copper out-diffusion can be reduced and the adhesion between the contact pad and the insulating layer may also be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.