Method of test probe alignment control

US9000798B2 · kind B2 · utility

Assignee

• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

• Jui-Long Chen · Taichung, TW
• Chien-Chih Liao · Taichung, TW
• Tseng Chin Lo · Hsinchu, TW
• Hui-Yun Chao · Zhubei City, TW
• Ta-Yung Lee · Hsinchu, TW
• Jong-I Mou · Guoxing Township, TW
• Chin-Hsiang Lin · Hsinchu, TW

Key dates

• Filing date: Jun 13, 2012
• Grant date: Apr 7, 2015
• Expiry date: Jun 18, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A system and method for aligning a probe, such as a wafer-level test probe, with wafer contacts is disclosed. An exemplary method includes receiving a wafer containing a plurality of alignment contacts and a probe card containing a plurality of probe points at a wafer test system. A historical offset correction is received. Based on the historical offset correct, an orientation value for the probe card relative to the wafer is determined. The probe card is aligned to the wafer using the orientation value in an attempt to bring a first probe point into contact with a first alignment contact. The connectivity of the first probe point and the first alignment contact is evaluated. An electrical test of the wafer is performed utilizing the aligned probe card, and the historical offset correction is updated based on the orientation value.