Complex passive design with special via implementation
US9001031B2 · kind B2 · utility
15Cited by
8References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2012 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Jan 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This disclosure provides systems, methods and apparatus for vias in an integrated circuit structure such as a passive device. In one aspect, an integrated passive device includes a first conductive trace and a second conductive trace over the first conductive trace with an interlayer dielectric between a portion of the first conductive trace and the second conductive trace. One or more vias are provided within the interlayer dielectric to provide electrical connection between the first conductive trace and the second conductive trace. A width of the vias is greater than a width of at least one of the conductive traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.