Wafer position correction with a dual, side-by-side wafer transfer robot

US9002514B2 · kind B2 · utility

Assignee

• Novellus Systems, Inc. · US

Inventors

• Damon Tyrone Genetti · Livermore, US
• Shawn M. Hamilton · Ramona, US
• Rich Blank · San Jose, US
• Sheldon Templeton · San Jose, US

Key dates

• Filing date: Nov 30, 2007
• Grant date: Apr 7, 2015
• Expiry date: May 27, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S901/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Methods and systems for positioning wafers using a dual side-by-side end effector robot are provided. The methods involve performing place moves using dual side-by-side end effector robots with active wafer position correction. According to various embodiments, the methods may be used for placement into a process module, loadlock or other destination by a dual wafer transfer robot. The methods provide nearly double the throughput of a single wafer transfer schemes by transferring two wafers with the same number of moves.