Method of detecting bitmap failure associated with physical coordinate
US9006003B1 · kind B1 · utility
1Cited by
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19Claims
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Key dates
| Filing date | Mar 20, 2014 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Mar 20, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/5604
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of detecting bitmap failure associated with physical coordinates is provided. In the method, data of wafer mapping inspection are obtained first, and the data include images of defects in each of layers within a wafer and a plurality of physical coordinates of the defects. Thereafter, a bitmap failure detection is performed to obtain digital coordinates of failure bits within the wafer. The digital coordinates are converted into a plurality of physical locations, and the physical locations are overlapped with the physical coordinates so as to rapidly obtain correlations between the failure bits and the defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.