Package on package structures and methods for forming the same
US9006032B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2014 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Mar 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a semiconductor device package includes removing a portion of a first connector and a molding compound surrounding the first connector to form an opening, wherein the first connector is part of a first package, and removing the portion of the first connector comprises forming a surface on the first connector which is at an angle with respect to a top surface of the molding compound. The method further includes placing a second connector in the opening, wherein the second connector is part of a second package having a semiconductor die. The method further includes bonding the second connector to a remaining portion of the first connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.