Methods of forming bump and semiconductor device with the same
US9006037B2 · kind B2 · utility
0Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2013 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | May 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.