Methods of processing substrates
US9006081B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2012 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Feb 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of manufacturing a plurality of semiconductor chips are provided. The method may include providing a middle layer between a substrate and a carrier to combine the carrier with the substrate, thinning the substrate; after thinning the substrate, separating the carrier from the substrate; and after the carrier is separated from the substrate, cutting the substrate to form the plurality of semiconductor chips, wherein the middle layer is adhered to the carrier with a first bonding force, and the middle layer is adhered to the substrate with a second bonding force, and wherein the second bonding force is greater than the first bonding force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.