Semiconductor structure having fluoride metal layer and process thereof
US9006092B2 · kind B2 · utility
2Cited by
19References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2011 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Dec 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/685
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure includes a substrate, a dielectric layer and a fluoride metal layer. The dielectric layer is located on the substrate. The fluoride metal layer is located on the dielectric layer. Furthermore, the present invention also provides a semiconductor process to form said semiconductor structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.