Method of manufacturing printed circuit board and printed circuit board
US9006579B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2012 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | May 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/118
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a printed circuit board includes: forming a copper layer of an interconnection pattern on a base film; laminating a cover lay on the base film so as to expose a part of the copper layer from the cover lay and cover the copper layer by the cover lay; mechanically polishing at least the exposed portion of the copper layer; and performing a plating process on the exposed portion of the copper layer so as to form a plated layer on the copper layer, and the angles α1 and α2 between the polishing direction of the exposed portion of the copper layer and the bending lines C1 and C2 satisfy the following formula (1):30°≦α1 and α2≦150° (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.