Method of depositing protective structures
US9006681B2 · kind B2 · utility
0Cited by
9References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2014 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Mar 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31749
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process of preparing a lamella from a substrate includes manufacturing a protection strip on an edge portion of the lamella to be prepared from the substrate, and preparing the lamella, wherein the manufacturing the protection strip includes a first phase of activating a surface area portion of the substrate, and a second phase of electron beam assisted deposition of the protective strip on the activated surface area portion from the gas phase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.