Semiconductor device and method for fabricating the same
US9006866B2 · kind B2 · utility
3Cited by
2References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2012 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Dec 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device and a method for fabricating the same are disclosed, which can prevent migration of copper (Cu) ion when forming a Through Silicon Via (TSV). The semiconductor device includes a through silicon via (TSV) formed to pass through a semiconductor substrate; an oxide film located at a lower sidewall of the TSV; and a first prevention film formed to cover an upper portion of the TSV, an upper sidewall of the TSV, and an upper surface of the oxide film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.