Patent · US Active

Integrated circuit interposer and method of manufacturing the same

US9006908B2 · kind B2 · utility

13Cited by

3References

16Claims

0Family size

Assignee

Marvell Israel (M.I.S.L) Ltd. · IL

Inventors

Carol Pincu · Rishon LeZion, IL
Ido Bourstein · Pardes Hana-Karkur, IL

Key dates

Filing date	Jul 31, 2013
Grant date	Apr 14, 2015
Priority date	—
Expiry date	Jul 31, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/157
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Systems and methods are provided for an interposer for coupling two or more integrated circuit dies to a circuit package. A first integrated circuit portion is disposed on a first location of a single semiconductor substrate. A second integrated circuit portion is disposed on a second location of the single semiconductor substrate, where the second integrated circuit portion is electrically isolated from the first integrated circuit portion along a first axis. The first and second integrated circuit portions are configured to provide an electrical coupling to two or more corresponding top die integrated circuits across a second axis that is perpendicular to the first axis.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.