Electronic device
US9007770B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 12, 2013 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Jul 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20436
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat source. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material and 15 to 20 percent volume of air. The heat dissipation device has a surface thermally contacting the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. The heat source is located in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal conduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.