Patent · US Active

Pressure sensor package having a stacked die arrangement

US9013013B1 · kind B1 · utility

8Cited by

0References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Sebastian Beer · Munich, DE
Helmut Wietschorke · Laberweinting, DE
Jochen Dangelmaier · Beratzhausen, DE
Horst Theuss · Wenzenbach, DE

Key dates

Filing date	Dec 6, 2013
Grant date	Apr 21, 2015
Priority date	—
Expiry date	Dec 6, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A pressure sensor package includes a pressure sensor having a first side with a pressure sensor port, a second side opposite the first side, and electrical contacts. A logic die stacked on the pressure sensor has a first side attached to the second side of the pressure sensor and a second side opposite the first side with electrical contacts. The logic die is laterally offset from the electrical contacts of the pressure sensor and operable to process signals from the pressure sensor. Electrical conductors connect the electrical contacts of the pressure sensor to the electrical contacts of the logic die. Molding compound encapsulates the pressure sensor, the logic die and the electrical conductors, and has an opening defining an open passage to the pressure sensor port. External electrical contacts are provided at a side of the pressure sensor package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.