Patent · US Active

Micro-electromechanical semiconductor component

US9013015B2 · kind B2 · utility

3Cited by

6References

2Claims

0Family size

Assignee

ELMOS SEMICONDUCTOR SE · DE

Inventor

Michael Doelle · Munich, DE

Key dates

Filing date	Jan 10, 2011
Grant date	Apr 21, 2015
Priority date	—
Expiry date	Apr 3, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH10D48/50
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A micro-electromechanical semiconductor component is provided with a semiconductor substrate, a reversibly deformable bending element made of semiconductor material, and at least one transistor that is sensitive to mechanical stresses. The transistor is designed as an integrated component in the bending element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.