Michael Doelle
9Patents
4h-index
5Co-inventors
46Inventor score
Filing activity: Sep 30, 2004 → Feb 25, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8132465B1 | Sensor element placement for package stress compensation | Physics | 19 | Active |
| US9399572B2 | Microelectromechanical component and method for testing a microelectromechanical component | Performing Operations; Transporting | 5 | Active |
| US9403677B2 | Micro-electromechanical semiconductor component | Electricity | 4 | Active |
| US8402835B2 | Compensation of stress effects on pressure sensor components | Emerging Cross-Sectional Technologies | 4 | Active |
| US9013015B2 | Micro-electromechanical semiconductor component | Electricity | 3 | Active |
| US8082796B1 | Temperature extraction from a pressure sensor | Physics | 2 | Active |
| US8916944B2 | Stress-sensitive micro-electromechanical device and use thereof | Performing Operations; Transporting | 1 | Active |
| US8820169B2 | Compensation of stress effects on pressure sensor components | Emerging Cross-Sectional Technologies | 0 | Active |
| US7567663B2 | Telephone call processing | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.