Patent · US Active

Semiconductor packages and methods for producing the same

US9013890B2 · kind B2 · utility

0Cited by

8References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Udo Ausserlechner · Villach, AT
Carsten von Koblinski · Velden am Wörther See, AT
Sigrid Wabnig · Villach, AT
Volker Strutz · Tegernheim, DE
Robert Grünberger · Nandlstadt, DE

Key dates

Filing date	Jan 11, 2012
Grant date	Apr 21, 2015
Priority date	—
Expiry date	Jun 10, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The rim portion is thicker than the membrane portion. The package includes a semiconductor chip disposed in the recess and a backplane disposed under the membrane portion of the isolating container.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.