Connecting method of electronic component
US9015932B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2007 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Oct 11, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
It is to provide an electronic component connecting method capable of performing dehumidification within a short time without giving a thermal influence to an electronic component which has already been mounted on a wiring board.When a first connection terminal group 5 formed on a connection area 3 of a rigid board 1 is connected to a flexible board 2 where a second connection terminal group 6 has been formed by employing a thermosetting resin in an electrically conductive manner, since a connection area 3 which is heated in a step for thermally hardening the thermosetting resin is locally preheated, moisture, and oils and fats contained in the connection area 3 among such moisture, and oils and fats, which have been absorbed in the rigid board 1 are dehumidified. Thereafter, the thermosetting resin interposed between the first connection terminal group 5 and the second connection terminal group 6 is thermally hardened. Since the connection area 3 is locally preheated, the dehumidification can be carried out within a short time without giving a thermal influence to an electronic component 4 which has already been mounted on the rigid board 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.