Method of producing optical MEMS
US9018724B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2008 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Mar 28, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and apparatus for constructing MEMS devices is provided which employs a low cost molded housing that simultaneously provides precise and accurate alignment, mechanical protection, electrical connections and structural integrity for mounting optical and MEMS components. The package includes a MEMS die mounting surface, an optical component mounting surface and an optical imaging window monolithically fabricated with the MEMS die mounting surface in a predetermined orientation for providing alignment between the MEMS die and optical components. A MEMS adaptor plate is provided to facilitate connections of a MEMS die to external components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.