Three-dimensional semiconductor devices and methods of fabricating the same
US9019739B2 · kind B2 · utility
13Cited by
5References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2014 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Jan 10, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C7/1039
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
According to example embodiments of inventive concepts, a three-dimensional semiconductor device may include: a memory cell array including memory cells that may be arranged three-dimensionally, the memory cell array including a left side opposite a right side, and a top side opposite a bottom side in a plan view; at least one word line decoder adjacent to at least one of the left and right sides of the memory cell array; a page buffer adjacent to the bottom side of the memory cell array; and a string selection line decoder adjacent to one of the top and bottom sides of the memory cell array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.