Substrate processing system and substrate transferring method
US9022714B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2010 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | Jun 27, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S901/25
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing system and substrate transferring method capable of transferring a substrate bi-directionally through the use of substrate transferring device provided between two rows of processing chambers arranged linearly, thereby improving the substrate-transferring efficiency, the substrate processing system includes a transfer chamber having at least one bi-directional substrate transferring device for bi-directionally transferring a substrate; and a plurality of processing chambers for applying a semiconductor-manufacturing process to the substrate, wherein the plurality of processing chambers are linearly arranged along two rows confronting each other, and the transfer chamber is interposed between the two rows of the processing chambers, wherein the bi-directional substrate transferring device have a moving unit inside the transfer chamber, and horizontally moved by a linear motor; and a bi-directional substrate transferring unit in the moving unit, the bi-directional substrate transferring unit transferring the substrate to the processing chamber through a bi-directional sliding movement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.