Patent · US Active

Method for electron beam induced etching

US9023666B2 · kind B2 · utility

3Cited by
27References
26Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 13, 2009
Grant dateMay 5, 2015
Priority date
Expiry dateAug 13, 2029

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/32136
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The invention relates to a method for electron beam induced etching of a material (100, 200) with the method steps providing at least one etching gas at a position of the material (100, 200) at which an electron beam impacts on the material (100, 200) and simultaneously providing at least one passivation gas which is adapted for slowing down or inhibiting a spontaneous etching by the at least one etching gas.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.