Method for electron beam induced etching
US9023666B2 · kind B2 · utility
3Cited by
27References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2009 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | Aug 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for electron beam induced etching of a material (100, 200) with the method steps providing at least one etching gas at a position of the material (100, 200) at which an electron beam impacts on the material (100, 200) and simultaneously providing at least one passivation gas which is adapted for slowing down or inhibiting a spontaneous etching by the at least one etching gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.