Methods for processing substrates
US9023716B2 · kind B2 · utility
5Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2014 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | Jan 6, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.