Methods of forming epitaxial structures
US9029246B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2013 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Jul 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/125
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment is a method. A first III-V compound semiconductor is epitaxially grown in a trench on a substrate, and the epitaxial growth is performed in a chamber. The first III-V compound semiconductor has a first surface comprising a facet. After the epitaxial growth, the first surface of the first III-V compound semiconductor is etched to form an altered surface of the first III-V compound semiconductor. Etching the first surface is performed in the chamber in situ. A second III-V compound semiconductor is epitaxially grown on the altered surface of the first III-V compound semiconductor. The epitaxial growth of the first III-V compound semiconductor may be performed in a MOCVD chamber, and the etch may use an HCl gas. Structures resulting from methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.