Packaging devices and methods
US9030010B2 · kind B2 · utility
4Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2012 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Nov 22, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2064
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Packaging devices and packaging methods are disclosed. In some embodiments, a method of manufacturing a packaging device includes forming a plurality of through-substrate vias (TSVs) in an interposer substrate. The interposer substrate is recessed or a thickness of the plurality of TSVs is increased to expose portions of the plurality of TSVs. A conductive ball is coupled to the exposed portion of each of the plurality of TSVs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.