Heat dissipation system for power module
US9030823B2 · kind B2 · utility
2Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2012 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Jun 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.