Chip-on-film packages and device assemblies including the same
US9030826B2 · kind B2 · utility
4Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2012 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | May 16, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface, and a thermal deformation member adjacent to the second surface. The thermal deformation member has a construction that causes its shape to transform according to a temperature. Related devices and device assembles are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.