Methods and systems of object based metrology for advanced wafer surface nanotopography
US9031810B2 · kind B2 · utility
3Cited by
0References
13Claims
0Family size
Inventors
Key dates
| Filing date | Jun 27, 2011 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Nov 8, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method for enhanced and expanded localized geometry characterization. Objects of interest are enhanced, detected, and classified according to user-defined parameters, and this enables enhanced contrast and more accurate feature detection, as well as more accurately defined feature object regions for feature geometry measurement and characterization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.