Chemically amplified positive photoresist composition
US9034557B2 · kind B2 · utility
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14References
27Claims
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Key dates
| Filing date | Jun 1, 2010 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | Jan 3, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0397
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photoresist composition. The composition has the following: (a) one or more resin binders that include one or more acid sensitive groups and that are substantially free of phenolic groups protected by acetal or ketal groups; (b) one or more photo acid generators, that, upon exposure to a source of high energy, decompose and generate a photoacid strong enough to remove the one or more acid sensitive groups; (c) one or more ionic non-photosensitive additives including an iminium salt; and (d) one or more solvents. There is also a process for patterning relief structures on a substrate employing the photoresist composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.