Apparatus and method for endpoint detection during electronic sample preparation
US9034667B2 · kind B2 · utility
0Cited by
12References
20Claims
0Family size
Inventor
Key dates
| Filing date | Apr 12, 2013 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | Apr 12, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T409/303864
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for detecting an endpoint during removal of material from an electronic device includes while removing material from an electronic device-under-test (DUT) using a tip driven by a spindle, applying an input signal to the DUT via the tip and using an output signal received from one of the DUT and a mounting plate to which the DUT is attached to determine an endpoint for removal of material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.