Patent · US Active

Direct bonding process using a compressible porous layer

US9034728B2 · kind B2 · utility

1Cited by
4References
24Claims
0Family size

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Inventor

Key dates

Filing dateMar 4, 2013
Grant dateMay 19, 2015
Priority date—
Expiry dateNov 1, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/00014
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for direct bonding between a first element and a second element, including at least the following steps:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.