Patrick Leduc
9Patents
2h-index
15Co-inventors
40Inventor score
Filing activity: Sep 22, 2009 → Aug 1, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8288250B2 | Method for transferring chips onto a substrate | Electricity | 6 | Active |
| US10438921B2 | Method for direct bonding with self-alignment using ultrasound | Electricity | 2 | Active |
| US9028138B2 | Electronic device | Electricity | 2 | Active |
| US9034728B2 | Direct bonding process using a compressible porous layer | Electricity | 1 | Active |
| US9929082B2 | Receiving structure for electrically connecting a nano-object on a surface thereof and re-establish electrical contact with the nano-object on the opposite surface, and methods for manufacturing the structure | Electricity | 0 | Active |
| US10797103B2 | Method for producing a bolometric detector | Electricity | 0 | Active |
| US10461210B2 | Method for manufacturing a detection device with two substrates and such a detection device | Electricity | 0 | Active |
| US10168223B2 | Electromagnetic radiation detector encapsulated by transfer of thin layer | Physics | 0 | Active |
| US10858244B2 | Device for connecting at least one nano-object associated with a chip enabling a connection to at least one external electrical system and method of fabrication thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.